Presentation Profile
Thermal Analysis of Coatings – Photo-DSC, TGA-FTIR, and Dielectric Analysis
Currently Scheduled: 1/19/2018 - 2:10 PM - 3:25 PM
Room: Room 371 D
Main Author
John Erne - Netzsch Instruments
Abstract:
Coatings and adhesives materials are becoming ever more complex in formulation, and are present in advanced materials and products. This seminar will examine three primary instrumental techniques relevant for R&D, QC as well as technical service of coatings and adhesive materials. DEA for cure monitoring, photo-DSC for optimization of cure conditions, as well as TGA-FTIR for product (de)formulation will be the primary points of discussion. Extensive applications in these fields will be explored. NETZSCH leads the market in turnkey solutions for advanced thermal analysis. Come find out why!
